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 Home > Products > Thermally Conductive Silicone > PGN thermal-conductive silicone gel

PGN thermal-conductive silicone gel

PGN series thermal-conductive silicone gel is a kind of two-component flexible silica gel with low stress and high thermal conductivity. The product is generally used to fill the gap of heating components, eliminate the assembly tolerance of the device after curing, and effectively reduce the stress damage to the components due to it is vulcanized after automatic dispensing assembly. The cured thermal gel has similar properties to the thermal pad, with excellent high temperature resistance and aging resistance, and can work at -40~200°C for a long time.

Product Advantages

  • Excellent electrical insulation
  • Excellent temperature and chemical stability
  • Low viscosity and easy dispensing
  • Low compression force application with adjustable curing time
  • Thermal conductivity: 1.0-3.0W/(m•K)

Performance Parameters

Basic performanceTest methodModel
GGT-10GGT-15GGT-20GGT-30
Before vulcanizationAppearanceAVisualizationYellowBlackGrayBlue
BVisualizationWhiteWhiteWhiteWhite
Viscosity(Pa·s)AASTM D2196100250350400
BASTM D2196100250350400
Mixing ratio(A:B)/1:01
TIME(h)/1~2
After vulcanizationElectrical Strength ROHS(KV/mm)ASTM   D149≥7
Dielectric constant(@1MHz)ASTM   D150≤4
Dielectric loss(@1MHz)ASTM   D1500.01
Volume Resistivity(Ω·cm)ASTM   D2571.0×1013
RoHS Compliant/PASS
Hardness(Shore 00)ASTM D224050505050
Density (g/cm3)ASTM D79222.32.53
Flame-retardant RatingUL94V-0V-0V-0V-0
Thermal Conductivity(W/m·K)ASTM D547011.523

The above data is the average value of the overall test. Please contact our company for more technical information.

Application Scenarios

Technical Data

  • TDS
  • MSDS
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